TL;DR: SK hynix will showcase its AI memory technologies at CES 2025, featuring solutions for on-device AI and next-generation AI memories. The company aims to highlight its technological ...

Counterpoint Research analyst Neil Shah said the rise of Agentic AI is reshaping the semiconductor industry by increasing ...

Forbes contributors publish independent expert analyses and insights. This article discusses memory and chip and system design talks at the 2025 AI Infra Summit in Santa Clara, CA by Kove, Pliops and ...

As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...

TL;DR: SK hynix has introduced the world's first 16-Hi HBM3E memory, offering up to 48GB per stack, marking the highest capacity and layer count in HBM memory. This development follows NVIDIA's ...

The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory stack. A JEDEC move made that unnecessary with this generation, but it’s ...

Superchips are redefining the backbone of AI and computing, requiring more memory to meet increased demands. As AI models scale in size and complexity, the need for specialized solutions capable of ...

As AI demand soars, global memory shortages are driving costs up and reshaping the tech landscape.

Edge AI—enabling autonomous vehicles, medical sensors, and industrial monitors to learn from real-world data as it arrives—can now adopt learning models on the fly while keeping energy consumption and ...

Walk into any modern AI lab, data center, or autonomous vehicle development environment, and you’ll hear engineers talk endlessly about FLOPS, TOPS, sparsity, quantization, and model scaling laws.