Researchers have developed a new method for detecting defects in additively manufactured components. Researchers at the University of Illinois Urbana-Champaign have developed a new method for ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
Longitudinal (top) and axial (middle) images of X-Ray CT data of parts with 6 internal defects: a spherical clog, a stellated shaped clog, a cone shaped void, a blob shaped void, an elliptical warp of ...
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